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    Film Platinum Resistance

    Applied to the semiconductor industry:

    Sensor and Chip-Sensor-Other

    Product brand

    XiZer

    Specification model:

    Film Platinum Resistance

    In stock:

    1000

    Place of origin:

    China-北京市

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    Brand:XiZer

    model:Film Platinum Resistance

    Own series:Sensor and Chip-Sensor-Other

     Film platinum resistance
    Temperature-measuring and temperature-controlling elements have small volume, light weight, high precision and fast anti-vibration response.

    Thin film platinum resistance is a new type of temperature measurement and temperature control element. It has the characteristics of small size, light weight, high precision, anti-vibration, fast response and so on. MCF has successfully developed products with reliable performance in accordance with IEC751 standard, relying on functional materials and using advanced film forming and lithography technology. At present, MCF has been widely used in chemical industry, power generation, automotive, medical, pharmaceutical, instrumentation, aerospace, military and other fields.
     

    Characteristic:
    1. High accuracy, high linearity, good long-term stability.
    2. It can accurately measure the real temperature of the surface, with high sensitivity and fast response.
    3. Small size, easy to install in small places
    Characteristic:
    1. Resistance range 10-2000_
    2. Typical resistance, model, working temperature, fixed lead glaze

     

    Nominal resistance

    Model

    working temperature

    temperature coefficient

    Fixed Lead Glaze

    100Ω

    TFR101

    -50∽+500℃

    3851ppm/℃

    green

    1000Ω

    TFR102

    -50∽+500℃

    3851ppm/℃

    green

    3. deviation

    Deviation grade

    Temperature deviation

    resistance tolerance

    Temperature coefficient deviation

    A

    ±(0.15+0.002ItI

    ±0.06%

      ±6ppm/℃

    B

    ±(0.30+0.005ItI

    ±0.12%

    ±12ppm/℃

    C(2B)

    ±(0.60+0.007ItI

    ±0.24%

    ±24ppm/℃

    4. Shape size (mm)

    Model

    width

    length

    thickness

    Lead wire

    TFR101

    2±0.1

    2±0.2

    1.2±0.2

    10±1

    TFR102

    2±0.1

    3±0.2

    1.2±0.2

    10±1

    5. Lead Material
    0.2 Anti-oxidant Silver-plated High Purity Nickel Wire
    Welding Effect of Lead and External Connection

     

    welding method

    Explain

    Soldering

    Silver has excellent solderability and is more suitable for high temperature solders. Its technological properties are superior to platinum and gold plating.

    Crimping

    Silver has softer properties and is more firmly and reliably pressed with other metals.

    Welding (Electrode)

    Silver has good electrical conductivity, welding assistant characteristics, wide welding voltage regulation range, fast and reliable discharge at solder joints.

    Oxygen welding (flame)

    When the melting point of silver layer is low, it shrinks slightly, and the reliability of welding between nickel wire and wire does not affect the product performance.

     

    6. Insulation Resistance 100M (Room Temperature 10VDC)
    7. Self-temperature rise of 3.6 mW/ C (in air)
    8. Response time T0.63 < 0.18S (in water)
    9. Recommended working current 1 mA

     




    For expert advice on thin film platinum resistance, please contact 010-57168560
     

    advisory

    If you have any questions before purchasing, please contact us.

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