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    激光开封机decap芯片失效分析IC开帽

    Applied to the semiconductor industry:

    Testing Equipment-Surface&internal Inspection-表面缺陷检测

    Product brand

    ADVANCED

    In stock:

    666

    Place of origin:

    National

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    Brand:ADVANCED

    model:

    Own series:Testing Equipment-Surface&internal Inspection-表面缺陷检测

     主要用途
    封装产品进行开封,使chip芯片裸露出来,方便后续分析(观察芯片表面、做EMMI、做去层、探针做电信号测量等)。
     
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    性能参数
    a)激光平均输出功率:10W
    b)激光波长:1060nm
    c)激光重复频率:20KHz-100KHz
    d)开封范围:100mm x 100mm
    e)开封深度:0.4mm
    f)重复精度:±0.003mm
     
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    应用范围
    主要应用在铜绑定线,铝绑定线及COB等特殊类封装的开帽分析。

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