Research-based Multifunctional Laser Machining System MLPS-50PS
The system mainly aims at scientific research customers and provides laser processing platform for many kinds of materials. It can cut, scribe, groove and mark the vast majority of materials. The specific parameters are as follows:
|
Technical parameters: |
||
|
Scan range |
mm |
60×60（Or customization） |
|
X/Y stroke |
mm |
200×200 |
|
Minimum line width |
μm |
20 |
|
Scanning Processing Speed |
mm/s |
≤4000 |
|
Maximum moving speed of platform |
m/min |
18 |
|
Processing mode |
Double head switching |
Scanning type A (subgraph, layered, zoom)/B straight cut type |
|
|
||
|
|
||
Applications:
Precision micro machining industry, such as polymer film ITO scribed line, metal ceramic composite materials cutting, LTCC/Al2O3 ceramic cutting manufacture, biodegradable polymers, blood vessels and microstructure, polymer film cold working, the gear processing, micro silicon micro drilling, PCB drilling, ceramics and glass micro drilling, glass microchannel processing, sapphire stone groove, polycrystalline diamond nozzle processing.Diamond wheel micro-structure manufacturing and other fields, especially suitable for precision processing experiments of various materials in the field of scientific research.
Laser source can be replaced by other kinds of lasers, such as green nanosecond short pulse solid state lasers, to process hard and brittle materials, such as glass cutting, drilling, PCB cutting, diamond cutting and so on. Details, please contact us.
Cutting Classify System
Cutting Classification Processing System RS-7000G Lokorokko
main features
Excellent production performance UPH: 15,000 (handling placement device only)
Three linear slider transport line [standard]
Cutting System with Double Axis and Double Clamp Table (EAD 6340R)
Live bug [standard equipment]
Placement: disc/tube/barrel
Noise level below 70 decibels
Precision Video Detection System
Machining of Diamond Wheel
CVD cutting Diamond etching
Note: Laser source can be replaced by other kinds of lasers, such as green nanosecond short pulse solid state lasers, to process hard and brittle materials, such as glass cutting, drilling, PCB cutting, diamond cutting and so on. Details, please contact us.