Product characteristics:

Patented optical head, with wavelength IR1310 probe, can accurately measure the position and thickness of the object to be measured in a non-contact manner.
Combined with coaxial IR and white light microscopy, with the probe of wavelength IR1310, the observation point is the measurement point, and the execution of programming is faster.
Depending on the customer's needs, it can also provide a fully automated platform with a maximum measurable size of 2 inches wafer.
It can be matched with perspective and reflection IR light source to increase infrared observation function.
Sensor can be installed to measure 3D profile of film and product surface.

 

Application:

• TSV Depth and Width
  Thinning process
  Stacking process
  3D IC counterpoint
  Thickness Measurement of Multi-Layer Stacked Sandwiches
  Bump height
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3D IC TSV

• Formation of silicon perforated TSV:
  The hole position can be found correctly by white light microscope and measured directly.

 


• Backend process:
  The TSV points can be observed by IR visualization, and the wafer thickness, TSV and RST can be measured simultaneously.
  Chip stacking:
  Measurement of Wafer Defects and Roughness Using White Light and IR Microscopes
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Wafer thinning:
Measurement TTV

• 、Bow and Warp Bonding inspection 及 edge trimming