高精度倒装芯片焊接机(High Accuracy Filp-Chip Bonder M-1300)
- 适用于雷射相关或/光学产品封装产业或是需超高精度封装类型 (for laser-assisted packaging, optical device packaging)
- 额外应用:雷射量测/紫外线光 (Laser measurement/UV/Ultra Sonic)。
- 精度:±1μm。
- 可应用在研发/实验室 (used for R&D or Lab.)
高精度倒装芯片焊接机(High Accuracy Filp-Chip Bonder M-1300)
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| unit price | ￥0.00 |
| in stock | 100台 |
| Brand | 未填写 |
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Contact information
the company:勤运国际贸易（太仓）有限公司
status:Offline Send a letter Online conversation
Name:朱军(Mr)
职位:销售工程师
phone:18913205925
Mobile phone:18913205925
传真:0512-53862002
area:China-江苏省
address:江苏省太仓市北京东路88号太仓软件园东O栋
status:Offline Send a letter Online conversation
Name:朱军(Mr)
职位:销售工程师
phone:18913205925
Mobile phone:18913205925
传真:0512-53862002
area:China-江苏省
address:江苏省太仓市北京东路88号太仓软件园东O栋