接触式测厚仪
膜厚测试仪 宁丰凯电子
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膜厚测试仪

 

2D非接触式扫描系统 适用于厚膜印刷,混成电路(Hybrid Circuit),BGA,TAB FLIP/CHIP,SOLDER BUMPING 厚度量测,SMT印刷锡膏量测。激光非接触式量测,干膜及湿膜皆可量测。0.125um动态高分辨率,量测精度达1um,可量测:

2D (y,z or x,z) 
Height 
Height (Avg)
Length 
Angle 
Angle (Planar)
Center 
Roughness
Radius (Avg, Max, RMS, Rz)

 


2D/3D
非接触式扫描系统,PCB 基板变型量,半导体组件及晶圆质量检验, Copper铜箔厚度及粗糙度,Solder Mask防焊绿漆与Silkscreen厚度量测,封装凸块检测 Bump InspectionDie Attachment平整度量测。 激光非接触式量测,干湿膜皆可量。可设定多点自动量测,提供分析结果。适用于厚膜印刷,混成电路(Hybrid Circuit),BGA,TAB FLIP CHIP 之厚度量测。可量测参数:

 

3D(x,y,z) 2D (y,z or x,z) 

Height Height (Avg)

Length Volume

Angle Angle (Planar)

Center Roughness

Radius (Avg, Max, RMS, Rz)

         ※Roughness (Avg, Max,RMS, Rz)
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