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半导体光电外延片代工服务

Published on:2017-11-10 Author:6hxopto

   基于公司技术团队在半导体光电子材料及器件领域十多年的技术积累以及MOCVDEBLICP等专业设备平台,为企业、高校、科研院所提供半导体光电外延片材料的全方位代工服务,涵盖光电外延片结构设计、材料外延、光栅制作、测试分析等方面,主要服务内容包括InP基材料和器件(LD/PD/QPSK/Modulator)、GaAs基材料和器件(LD/Solar Cell/SESAM/PD)、GaSb基材料和器件(LD/PD/SESAM)、GaAsInP基量子点材料和器件、硅基III-V材料和器件(Heteroepitaxy)等。

分类/Category 应用/Application 说明/Description
光电材料外延和表征
Customer designed epitaxy
& characterization
GaAs/InP based bulk/quantum well/quantum dot
Superlattice/tunnel junction
 
GaAs/InP based secondary epitaxy P or N-doped InGaAs/InP, AlGaAs/GaAs
Butt-joint regrowth InGaAsP/InP
Holographic grating fabrication  
Designed nano-pattern (grating/nano-hole) fabrication by Electron Beam Lithography    
XRD/PL mapping/Hall/ECV/SEM PL detector (800-2400 nm)

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