Flip Chip BGA/PGA Series

Published on：2017-12-26 Author：6tfw

 
Production Overview

Flip Chip interconnection, also knownas Controlled Collapse Chip Connection, C4, has been identified as a high performance packaging solution to meet the growing need for products with increased electrical performance, high I/O, and high system reliability as a replacement for conventional wire bond process. Utilizing whole die area as for electrical connection, substrate I/O per unit exponentially increased vs. perimeter wire interconnection technology.

Flip chip interconnect also allows direct connection with on-die power planes which enables increased electrical performance including increased switching speed and more efficient power distribution to the IC performance at lower operating voltages.

 

TF-AMD Flip Chip are assembled with single unit laminate which is the highest routing density through build-up technology to maximize the device performance &conventional ceramic substrate for reliability enhanced package solution. Combined with Flip Chip interconnection, TF-AMD provides optimal design flexibility for final package design& product format to fit an end user requirement.

TF-AMD offers Flip Chip BGA packages with ball counts up to 3000 & PGA package up to 2000

Application

Flip Chippackage is considered one of the most established industry platform applicable for high pincount and/or high performance ASICs. Large body FC BGA/PGAs provide package solution forComputing (microprocessors / graphic, server), gaming,high bandwidth networking/Communicationdevices. Combined with Flip Chip technology& BGA/PGAlead format, TF-AMD help to enable SMT and also pin insertion application.

Features

Flip Chip BGA/PGA Packaging

Package Types: Bare die, Stiffener, Lidded (Top hat & flat top)

·         Wafer Node ³14/16nm ELK(extreme low K) qualified, 7nm in development.

·         Package sizes from 12mm to 55mm (75mm in development)

·         Die area up to 800mm^2

·         Lead Free, Eutectic, High-Pb bump for Flip Chip connection

·         Passive component size down to 01005

·         High thermal performance solution using Indium metal TIM

 

·         Substrate

o    4 – 18 layers laminate build up

o    Coreless, 0.2mm, 0.4mm, 0.8mm, 1.0mm available

o    High CTE ceramic / LTCC alumina ceramic

o    BGA / PGA

 

·         Footprints Pitch

o    BGA : 0.5mm, 0.65mm, 0.8mm and 1.0mm

o    PGA : 1.0mm, 1.27mm

 

·         Other Option

o    Multi-die capability

o    Die binning to waffle pack up to 256 BINs

 

Flip Chip BGA/PGA Test

·         Test Product Engineering

o    TF-AMD test provides a competitive test solution to our customers ranging from test development, platform conversion, and product maintenance and test data analysis.

o    The team has rich test development experience of various product portfolio, including high-end digital, mix-signal, SOC and high speed products.

 

·         Adding Value to Customer

o    Reduce customer overhead by outsourcing projects / tasks to avoid maintaining a large scale of dedicated team

o    Incorporate industrial standard through leveraging best known method from our database & continuous cost saving by driving test time reduction, yield improvement

 

·         Service Solutions

o    Wafer Sort test development

o    Final Test development

o    Low cost platform conversion

o    Multi-site enablement

o    Burn-in capabilities

 

·         Test Development Experience

o    CPU, APU, GPU

o    Chipset

o    Digital Audio

o    baseband

o    Microcontroller

o    LCD Driver

o    Touch Panel Driver

 

·         ATE platforms and products

ATE	Digital	Mix-Signal	SOC	CPU/GPU
Advantest 93K	·	·	·	·
Advantest T2000	·	·	·	·
LTX Sapphire	·			·
Teradyne J750	·	·

 

Reliability Test Standards

Reliability Test	Reference Standard	Test Conditions
Preconditioning	JESD22-A113	MSL 3
Preconditioning + Temp Cycling	JESD22-A104	0-100˚C, 3K cycles
Preconditioning + Unbiased HAST	JESD22-A118	condition A (85% RH, 130C, 96hrs)
High Temp Storage	JESD22-A103	125˚C for 1k Hours

 Note) PGA does not required Preconditioning

 

Design Rule

 

Top Hat Single Piece Lid

 

·         Lid size=substrate size-0.2mm

·         Standard foot sizes

o    2mm for 15-25mm body

o    3mm for 27-31mm body

o    4mm for 33-50mm body

·          

·         Max 3mm on all four sides (UF will flow under the bend/slant of the HS). Extended design rule allow Max. 2.5mm for the body size ≤31mm

 

·         Lid is centered

 

·         Cavity depth for 12inch wafer SPL is 0.8mm and total thickness is 1.3mm

o    TIM Thickness target: 40um (Max. 100um)

o    Adhesive Thickness target: 120um (Max. 200um)

o    Lid manufacturing tolerance: +/-50um

 

·         Body size <31mm support bare die structure (without stiffener/lid construction)

 

Packing& Shipping (in house standard)

 

BGA / PGA (Tray)

PKG TYPE	Body Size(mm)	QTY/Tray	Tray/Inner Box
BGA	19x19	84	6+1(bank)
BGA	23x23	60	10+1(bank)
BGA	24.5x24.5	44	10+1(bank)
BGA	27x27	40	10+1(bank)
BGA	27x31	32	10+1(bank)
BGA	29x32	24	10+1(bank)
BGA	29x37	21	10+1(bank)
BGA	40x40	21	10+1(bank)
BGA	45x45	12	10+1(bank)
BGA	42.5x42.5	12	10+1(bank)
BGA	50x50	10	10+1(bank)
PGA	35X35	18	10+1(bank)
PGA	40x40	12	10+1(bank)