HOME

CN|EN

  • Sensors
  • Equipment
  • Consumable
  • Company

Main Searching：

sensor  Cleaning  Cleaning equipment  machining  polisher 
Shopping Cart     0
User Center
Product Category
Home » Technology » Processing » Silicon Wafer » 正文

Silicon Wafer Slicing

Published on：2017-12-27 Author：3138150

Wafer processing


Application Notes: advantage：
  • Microelectromechanical Processing
    Surface grooving
    Advanced Packaging Process
    Wafer slicing
  •  
  • High yield
    Good dimensional consistency
    High Density Machining
    Machinable arbitrary shape
    Small heat affected zone
    dry machining
    Suitable for Thin Materials
  •  

       
Low-k slot drill hole drill hole Scribing

 

Processing Technical Indicators（单位：µm）

Borehole thickness

Outlet aperture

Φout

import and export differences

Φin-out

cutting

Slotting

Character carving

250µm

＜100

15~25

thickness

Chip Size

Cutting width

45~60

character height

＞150

300~1000

40~80

＜200

200*200

    

＞1000

75~100

＜500

500*500

Cutting depth

45~60

500μm

＜100

20~35

  

300~1000

50~90

＞1000

80~140

700μm

＜100

30~40

  

300~1000

120~180

＞1000

150~220

Seller Info after you register

Prompt：Registered View!

Consumer Hotline：00864001027270

Prompt：Registered View!

About us | Shopping guide | Business license | Help center | Links | Contact us

Copyright© Semiconductor mall 2015-2016，All Rights Reserved  

JingICPPrepare15002921    

Online service

Service Hotline

4001027270

Function and characteristics

Prices and offers

WeChat public number