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Home » Technology » Processing » SiO Wafer » 正文

Glass Sheet Drilling

Published on：2017-12-27 Author：3138150

Glass processing


Application Notes: advantage：
  • Advanced Packaging Process
    Microelectromechanical Processing
    Graphical sculpture
    Surface grooving
    Contour cutting
    Touch panel
    Inner carving
  •  
  • High yield
    Good dimensional consistency
    Machinable arbitrary shape
    High Density Machining
    Non-contact Machining
    Small heat affected zone
    dry machining
    Suitable for Thin Materials
  •  

     
High density drilling,Pitch:500µm Wafer-level packaging applications Application of TGV, T300µm, Φin70, Φout50
     
Notched machining Special Shape Cutting Graphic engraving

 

Processing Technical Indicators（unit：µm）

Borehole thickness

Outlet aperture

import and export differences

Chipping

carving

Inner carving

Microchannel

300µm

＜50

＜20~40

＜10~30

2D Barcode
14*14 Characters Size:＞3mm*3mm

Thickness＞300µm
character height：2mm

width200µm

＜1000

＜90~130

＜50~120

＞1000

＜20~40

＜20~40

600μm

＜400

＜120~150

＜50~120

＜1000

＜140~180

＜50~120

 

＜1000

＜180~220

＜50~120

1mm

＜500

＜180~250

＜50~120

＜1000

＜200~300

＜50~120

＜1000

＜200~300

＜50~120

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