Service Hotline
4001027270
Application Notes: | advantage: |
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High density drilling,Pitch:500µm | Wafer-level packaging applications | Application of TGV, T300µm, Φin70, Φout50 |
Notched machining | Special Shape Cutting | Graphic engraving |
Processing Technical Indicators(unit:µm)
Borehole thickness |
Outlet aperture |
import and export differences |
Chipping |
carving |
Inner carving |
Microchannel |
300µm |
<50 |
<20~40 |
<10~30 |
2D Barcode |
Thickness>300µm |
width200µm |
<1000 |
<90~130 |
<50~120 |
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>1000 |
<20~40 |
<20~40 |
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600μm |
<400 |
<120~150 |
<50~120 |
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<1000 |
<140~180 |
<50~120 |
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<1000 |
<180~220 |
<50~120 |
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1mm |
<500 |
<180~250 |
<50~120 |
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<1000 |
<200~300 |
<50~120 |
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<1000 |
<200~300 |
<50~120 |
Seller Info after you register