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Home » Technology » Process design » 正文

MEMS加工

Published on：2018-04-19 Author：startmems

1，光刻
   1X光刻，步进式光刻，双面对准光刻
2.薄膜沉积
   LP SIN OXIDE, PE SIN OXIDE,
3,金属沉积
  Pt， Au， Al的蒸发和溅射
4，刻蚀
 湿法腐蚀 SIN oxide ，Al， SIN
 干法
5，光刻版制版
6，封装划片
7，减薄，激光切割




























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