HOME

CN|EN

  • Sensors
  • Equipment
  • Consumable
  • Company

Main Searching：

sensor  Cleaning  Cleaning equipment  machining  polisher 
Shopping Cart     0
User Center
Product Category
Home » Technology » Process design » 切割 » 正文

Wafer Thinner

Published on：2018-05-22 Author：mpack

Provide 6-12 inch wafer thinning service with minimum thinning thickness of 80 microns.
Provide 6-12 inch wafer cutting service (cutting path minimum 50 micron)
MPW MPW single chip scribing, cutting.
Provide wafer backing service.

Seller Info after you register

Prompt：Registered View!

Consumer Hotline：00864001027270

Prompt：Registered View!

About us | Shopping guide | Business license | Help center | Links | Contact us

Copyright© Semiconductor mall 2015-2016，All Rights Reserved  

JingICPPrepare15002921    

Online service

Service Hotline

4001027270

Function and characteristics

Prices and offers

WeChat public number