Lab Failure Analysis

Published on：2018-07-02 Author：ceshi

Laboratory failure analysis commonly used projects, failure analysis for design engineers to constantly improve or repair the chip design, so that it is more in line with the design specifications to provide the necessary feedback information. Failure analysis can evaluate the validity of different test vectors, provide necessary supplements for production testing, and provide necessary information basis for verifying test process optimization. The main steps of failure analysis and content chip unpacking: remove IC sealant, while maintaining the integrity of the chip function, keep die, bond pads, bond wires and even lead-frame free from damage, in order to prepare for the next chip failure analysis experiment. SEM scanning electron microscopy/EDX component analysis: including material structure analysis/defect observation, element composition routine micro-analysis, accurate measurement of component size and so on. Probe test: It is convenient and fast to obtain the internal electrical signal of IC by microprobe. Laser Cutting: Cutting off a specific area of a circuit or chip with a micro laser beam. EMMI Detection: EMMI LLM is a highly efficient failure analysis tool. It provides a highly sensitive and non-destructive fault location method. It can detect and locate very weak luminescence (visible and near-infrared light), thereby capturing the leakage current visible light produced by various component defects or abnormalities. OBIRCH Applications (Laser Beam Induced Impedance Change Testing): OBIRCH is commonly used for high and low impedance analysis in chips and leakage path analysis in circuits. The OBIRCH method can effectively locate defects in the circuit, such as holes in the lines and holes under the through holes. The high resistance zone at the bottom of the through hole can also effectively detect short circuit or leakage, which is a powerful complement to the luminescent microscopy technology.
LG liquid crystal hot spot detection, a common item in laboratory failure analysis, uses liquid crystal to detect the reorganization of molecule arrays at IC leakage site, and presents speckle images different from other areas under the microscope, to find out the leakage area (more than 10 mA fault point) that troubles designers in practical analysis.
Fixed-point/non-fixed-point chip grinding: Remove the gold bump implanted on the LCD driver chip Pad and keep the Pad intact for subsequent analysis or rebonding.
X-Ray nondestructive detection: detection of defects in IC packaging such as layer peeling, bursting, voids and wire integrity, possible defects in PCB process such as poor alignment or bridging, open circuit, short circuit or abnormal connection defects, tin ball integrity in packaging.
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Common items in failure analysis
application area

Failure analysis                  

Wafer level  reliability

Device characterization         

Process modeling

IC Process  monitoring                 

Package part probing  

Flat panel probing               

PC board probing