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Failure analysis technology AC analog chip testing, today's semiconductor testing is becoming more and more difficult, and the use of modular, software-defined testing platform, is gradually showing its advantages in chip testing, especially in analog chip testing.
Modular testing technology and platform PXI were invented and launched by NI Company in 1997. It can continuously and calmly add the required functional modules according to the technology development and application requirements. In addition, PXI platform is based on software definition, using graphical operation interface, with strong flexibility, which is very important for test engineers. It not only simplifies the work, but also enjoys the fun of test work.
Failure analysis technology exchange NI emphasizes the open ecosystem construction. Specifically, the opening of technology and platform can enable more hardware and software partners to participate in the construction and optimization of modular test platform. In this way, the ultimate benefit is the customers, as well as the majority of test engineers.
As for the strategy of providing test solutions for customers, many enterprises emphasize on providing a complete set of solutions, while NI is different. Due to the changing market and customer needs, the company finds it difficult to provide a truly complete set of solutions. It emphasizes the flexibility of technology and platform. The key is to provide excellent software and hardware tools for users to choose.
Modular platform is more suitable for analog chip testing
With the rise of new technologies such as IoT and 5G, more and more analog chips and hybrid chips have appeared. With the increase of test difficulty, the traditional test equipment is difficult to meet the changing test requirements. At this time, the advantages of PXI flexible platform are gradually highlighted in the field of semiconductor testing.
In terms of chip testing, NI believes that the traditional semiconductor testing tools and methods are more suitable for the testing of digital and logic chips (such as CPU, memory, etc.) and have great advantages. In analog, mixed signal and RFIC testing, PXI modular hardware and software platform has more advantages, especially the large-scale deployment of 5G and the Internet of Things. The demand for analog and RF chips has increased dramatically, which is also the key development direction of NI in the field of semiconductor testing.
Common items in failure analysis
application area
Failure analysis
Wafer level reliability
Device characterization
Process modeling
IC Process monitoring
Package part probing
Flat panel probing
PC board probing
ESD&TDR testing
Microwave probing
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