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    COB倒装 MF 1307FB

    Applied to the semiconductor industry:

    Sensor and Chip-Led Gem

    In stock:

    1000000

    Place of origin:

    China-广东省

    Quantity:

    cut back increase

    price:

    Negotiable
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    Own series:Sensor and Chip-Led Gem

     COB倒装 MF 1307FB:
    High efficacy, high lumen, up to LM-80 standard Flip-Chip design, no gold wire encapsulating technology AIN ceramic base, thermal conductivity is 122W/M*K 80Ra, highest can make >95Ra which can present the real color of CoB Super thin phosphor film technology Dimension:13.3mm×13.3mm×1.0mm Beam Angle:120° RoHS Approved High density of LED Power/current/lumen Suitable for manual welding Anti-sulfur

    产品规格:

    Item Symbol Value

    Unit

    Max power P

    6-10

    W
    DC  Forward Current IF

    320-550(320)

    mA

    Reverse Current

    V -30 V
    Junction Tj 130

    Operating

    TOPR

    -30~+60

    Storage

    TSTG

    -35~+100

    Thermal Resistance

    RθJ-B

    2.2-3.4

    ℃/W

    Electrostatic

    ESD

    2000 V
    Soldering  

    350℃/3-5S

     


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