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深圳市晨日科技股份有限公司
公司主要研发制造，LED封装材料：固晶锡膏、混荧光粉硅胶、共晶助焊剂、贴片硅胶、...
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无铅通用锡膏 （Le...
Negotiable
底部填充胶
Negotiable
有铅通用锡膏（Lea...
Negotiable
无铅无卤锡膏
Negotiable
通用助焊膏
Negotiable
水洗锡膏
Negotiable
表面贴片红胶
Negotiable
高温无铅锡膏
Negotiable
高温高铅锡膏
Negotiable
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