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    水洗锡膏

    Applied to the semiconductor industry:

    Materials

    In stock:

    10000

    Place of origin:

    National

    Quantity:

    cut back increase

    Price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    Consumer Hotline:00864001027270

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    Model:

    Own series:Materials

    产品说明:
           ES-W800、 ES-350-SX等水洗锡膏是由水溶性助焊剂作为载体与低氧化度的球形焊料粉末组成。能有效去除晶片和焊盘氧化物,形成高强度的焊接,且空洞极低。体系中所有松香树脂触变剂均为水溶性材料,焊接之后残留物能完全溶于水,对焊点和器件无腐蚀性,挺高产品的长期使用可靠性,且降低清洗成本。

    产品参数:
           
    型号 主要合金 特点 应用
    ES-W800 Sn3AgCu0.5  无卤素,润湿性好,残留物能水洗 通用无铅零卤素要求PCB,半导体IGBT
    ES-350-SX SnPb37  无卤素,润湿性好,残留物能水洗 通用含铅要求PCB的印刷、点胶
    WS-1200 SnAg3Cu0.5X   无卤素,润湿性好,残留物能水洗,采用小粒径超微粉   固晶,满足大于20mil以上大功率晶片焊接,满足较高的二次回流焊温度
    WS-1300 SnPb10X     无卤素,润湿性好,残留物能水洗,采用小粒径超微粉   固晶,满足大于20mil以上大功率晶片焊接,满足较高的二次回流焊温度

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