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Negotiable
¥0.05
Negotiable
Negotiable
Negotiable
| 型号 | 主要合金 | 熔点(℃) | 应用 |
| ES-500 | SnPb92.5Ag2.5 | 287 | 半导体印刷工艺,高活性,适用于镀镍等芯片焊接 |
| SnPb95 | 308 | ||
| ES-660 | SnPb88Ag2 | 268 | |
| ES-665-SPA | SnPb92.5Ag2.5 | 287 | 精密半导体点胶工艺 |
| ES-650 | SnPb92.5Ag2.5 | 287 | 半导体针转移粘胶工艺 |
| SnPb90 | 275 |
If you have any questions before purchasing, please contact us.