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    高温高铅锡膏

    Applied to the semiconductor industry:

    Pack-Equip Consumable-Solid Crystal

    Product Brand

    晨日科技

    In stock:

    10000

    Place of origin:

    National

    Quantity:

    cut back increase

    Price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    Consumer Hotline:00864001027270

    Brand:晨日科技

    Model:

    Own series:Pack-Equip Consumable-Solid Crystal

    产品说明:
           ES500@ES660针对功率半导体封装焊接的高铅锡膏,可满足客户点胶和印刷工艺制程。可应用于功率管、二极管、三极管、整流桥、小型集成电路等产品封装焊接。

    主要参数:
          
    型号 主要合金   熔点(℃) 应用
    ES-500 SnPb92.5Ag2.5 287   半导体印刷工艺,高活性,适用于镀镍等芯片焊接
    SnPb95 308
    ES-660 SnPb88Ag2 268
    ES-665-SPA SnPb92.5Ag2.5 287    精密半导体点胶工艺
    ES-650 SnPb92.5Ag2.5 287    半导体针转移粘胶工艺
    SnPb90 275

    Advisory

    If you have any questions before purchasing, please contact us.

    Question:
     
    Ask

    熔点多高?铅含量多少?价格怎么样啊?

    sjfh  2017-08-14

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