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    KEEN-砂轮系列

    Applied to the semiconductor industry:

    Proc-Equip Consumable-Dicing-砂轮

    In stock:

    10000

    Place of origin:

    China-河南省

    Quantity:

    cut back increase

    Price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    Consumer Hotline:00864001027270

    Brand:

    Model:

    Own series:Proc-Equip Consumable-Dicing-砂轮

     

    硅片减薄砂轮主要应用于半导体晶圆的减薄与精研加工。我所生产的硅片减薄砂轮可替代进口产品,在日本、德国、美国、韩国及国产磨床上稳定使用,砂轮磨削性能优越,性价比高。

        加工对象:分立器件、集成电路衬底硅片及原始硅片等
        工件材料:单晶硅等半导体材料
        应用工序:背面减薄、正面磨削的粗磨加工和精研加工

    订货建议:
        初次订货时,请您提供以下参数,便于我们协助您选择适合的减薄砂轮
        1、 砂轮图纸或具体尺寸及所加工晶圆尺寸
        2、 所用磨床型号或磨削方式
        3、 各轴磨削余量、进给速度、转速
        4、 工件精度要求

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