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    半导体金线焊线机料盒SOMP2.0铝料盒

    Applied to the semiconductor industry:

    Pack-Equip Consumable-Others-物料盒

    Product Brand

    东虹鑫

    Specification model:

    230*139.5*85.2mm

    Shipping instructions:

    安能:100.00  

    In stock:

    1000

    Place of origin:

    China-广东省

    Quantity:

    cut back increase

    Price:

    63.00
    Transaction guarantee Secured Transactions Online banking to pay

    Brand:东虹鑫

    Model:230*139.5*85.2mm

    Own series:Pack-Equip Consumable-Others-物料盒

     适用于半导体后道工序生产,为引线框中间传递工具,具有方便,快捷,安全,高效率的特点.加工精细,耐用轻便, 质量稳定.定位精度高LED整体铝料盒(一体成型),烘烤铝料盒(直接进烤箱、温度200以上不变形),LED清洗铝料盒(开槽料盒),LED支架铝托盘,IC铝料盒,半导体封装料盒,引线框架料盒(Magazine),LED(固晶﹑焊线﹑灌胶﹑分光)铝料盒




    ,铝基板料盒等。

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