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Product Name: BGA Double-Headed Needle
Product Category: Semiconductor Test Needle
technical specifications
Contact Copper: Phosphorus Copper Tube
Spring: piano wire
Rod body: hard beryllium copper or SK material
Electroplating: Gold plating
Rated current: 3A, continuous
Contact resistance: 50m
Rated elasticity: 34g
Probe Solution
project Manufacturing capability
product For general use, composite probes, semiconductor probes, wafer probes,
Spring connection and peripheral consumables
Spring connection and peripheral consumables
Straightening Straightening and Cutting of metal Wire: Fine to 0.05 mm, True Circle
Degree: +0.001 mm
Degree: +0.001 mm
probe Capacity 60,000,000 units per month
Probe diameter Fine probe (>0.05 mm)
Spring connection Fine to 0.375mm, 3,000,000 sets/month
0# casing Capacity of 2,000,000 sets per month (R50 casing added)
Material Science Suzuki, Sumitomo, Japan, ROSLAU, Germany.
Standing Safety Stock of Korean Elephant and Other High Quality Piano Steel Wires
Standing Safety Stock of Korean Elephant and Other High Quality Piano Steel Wires
Major production equipment Machine group number manufacturing process
High-speed automatic probe production line (developed by our company) 20group From Straight Line to Forming
High-speed automatic linear cutter (developed by our company) 25group φ0.05mm～φ4.00mm
High-speed automatic needle grinder (developed by our company) 10group φ0.30mm～φ4.00mm
Semi-automatic needle grinder (developed by our company) 15group φ0.05mm～φ0.30mm
Probe assembly machine (developed by our company) 12group R0# R1#
Model Machine (developed by our company) 3stations
Automatic lathe (made in Japan) 5stations
Automatic lathe (made in China) 10stations
