铝丝劈刀

         

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 在半导体生产中，键合是一个关键的步骤。由于超过60%的生产成本产生线焊接之前，产量损失在这个阶段是急迫解决的一个重要问题。在键合这个重要的过程，必须采用优异的楔形工具和质量保证技术获得一个令人满意的产品。

在集成电路的连接器,电线和工具,焊接工具扮演着重要的角色，致力于实现一个稳定的、可靠的和可再生的过程。

楔形键合过程中是一种常见的互连技术等互连方法如球焊(使用毛细血管),标签,倒装芯片等。

铭沣的铝丝劈刀产品代理的以色列MPP（Micro Point Pro）的Wire Bonding Wedges系列产品。

Wedge for Fine Pitch application

The 4WF wedges model are designed for Fine Pitch applications, usually performed on automatic machines.

They feature the full range of dimensions that appear in common wedges, but in addition they include a VSR (Vertical Side Relief) to avoid wedge interference with the adjacent wires. The 4WF model has an oval hole and 30°, 45° or 60˚ feed angles to allow for smaller wire pitch. When using gold wires, a cross groove is used and TiC material is recommended.

To improve wire placement control in Fine Pitch gold wire applications, a combined concave and cross groove foot design is recommended.
     

A variety of standard finished tips are also available for this model.

Wedge for Standard Automatic Bonding

The 4WA wedges model are designed to fit the majority of common applications as well as most of the automatic wedge bonders employed in the industry. The standard wedge features a full range of feed angles to cover a wide spectrum of automatic wedge bonding requirements.

A number of standard features are available for this model, such as:

• Concave for Aluminum wire application
• CBR feature to strengthen the heel area of the 1st bond
• CG(Cross Groove) for Gold wire applications