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Current Position: Home » Consumable » Proc-Equip Consumable » Lapping&Polishing » 金刚石砂轮 »科美磨具 带键槽烧结金刚石/CBN切割片 青铜合金锯片切多晶硅用
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    科美磨具 带键槽烧结金刚石/CBN切割片 青铜合金锯片切多晶硅用

    Applied to the semiconductor industry:

    Proc-Equip Consumable-Lapping&Polishing-金刚石砂轮

    In stock:

    1000

    Place of origin:

    National

    Quantity:

    cut back increase

    Price:

    260.00
    Transaction guarantee Secured Transactions Online banking to pay
     烧结切割片主要用于精密陶瓷、蓝宝石玻璃、磁性材料、半导体材料、多晶硅、石材等棒材切槽及切断。特性:把持磨料能力强,耐磨性高,形状保持性好,使用寿命长!

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