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    Polishing Pad

    Applied to the semiconductor industry:

    Proc-Equip Consumable-Lapping&Polishing-抛光布

    Product Brand

    MCF

    In stock:

    1000

    Place of origin:

    Germany

    Quantity:

    cut back increase

    Price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    Brand:MCF

    Model:

    Own series:Proc-Equip Consumable-Lapping&Polishing-抛光布

           Product Diameter: 300mm, 350mm, 400mm,420mm,600mm.

    Product Thickness:0.5 – 3.0mm.

    Chemical Polishing Cloth is designed to satisfy the exacting requirements of chemo-mechanical polishing. The black napped urethane surface layer is intrinsic to the substrate giving superior nap strength and longer pad life.

    Chemical Polishing pads are supplied with a protected self-adhesive backing and each cloth is hermetically sealed in a polythene sachet.

    Product Diameter: 300mm, 350mm, 400mm,420mm,600mm.

    Product Thickness:0.5 – 3.0mm.

    Expanded Polyurethane Polishing Pad is designed to satisfy the exacting requirements of Si and similar material fine polishing. According to different process application, the surface of pad have two kinds of type: groove and non-groove.

    Expanded Polyurethane Polishing Pads are supplied with a protected self-adhesive backing and each cloth is hermetically sealed in a polythene sachet.

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