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    热压键合机

    Applied to the semiconductor industry:

    Processing Equipment-Bonding-热压键合机

    Product brand

    苏州汶颢

    Delivery period:

    30工作日Day

    In stock:

    1

    Place of origin:

    China-江苏省

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    consumer hotline:00864001027270

    Brand:苏州汶颢

    model:

    Own series:Processing Equipment-Bonding-热压键合机

     硬质有机芯片专用键合机是苏州汶颢芯片科技有限公司独立开发, 用于PMMA 、PC 、COC等硬质塑料芯片的封合,是国内外第一款硬质塑料微流控芯片加工专用设备。

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    If you have any questions before purchasing, please contact us.

    Question:
     
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    一次加工量是多少,加工速度怎么样??能干量产的活吗?

    whhg  2017-07-10

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