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    半导体专用光纤激光打标机

    Applied to the semiconductor industry:

    Packing Equipment-Packaging

    Product brand

    莱普

    Specification model:

    BLM20-5

    Delivery period:

    签订合同后20个工作日Day

    In stock:

    1000

    Place of origin:

    National

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

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    ¥10000.00

    Concerned Products

    Brand:莱普

    model:BLM20-5

    Own series:Packing Equipment-Packaging

     可与ASM、上野精机、利益高、复德、健鼎、SRM等国内外Handler相匹配;打标字符清晰;性能稳定,能满足7*24小时工作需求。

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    Question:
     
    Ask

    请问这个是紫外激光还是绿激光,打标精度多高??

    balk  2017-08-08

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