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    全自动超声波粗铝丝压焊机 模块机

    Applied to the semiconductor industry:

    Packing Equipment-Wire Bonding

    In stock:

    1

    Place of origin:

    China-广东省

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    consumer hotline:00864001027270

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    Own series:Packing Equipment-Wire Bonding

          全自动运行,自动识别芯片电极,自动送收料,均可旋转,可焊接各种角度芯片;

    焊头为高速伺服电机驱动,焊接速度快;

     占地面积小,节省净化车间成本;备件易得,维护简单,使用成本低;

    全中文界面、鼠标操作、亲切、易学、易掌握;

    焊点稳定可靠,一致性好;

    劈刀,切刀和耗材为市场通用规格,易采购,使用无孔长劈刀可大减少铝屑;

     高兼容性的工作台及送/收料系统,可最大限度的适应各类支架,仅调整少量元件及参数即可用于TO-251、TO-220、TO-3P系列等多种单排和多排框架生产;

    一人可同时操作多台机器,大大减轻劳动强度,最大的发挥人员的效能.


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