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    回流焊炉:ERSA Hot flow 3/20e

    Applied to the semiconductor industry:

    Packing Equipment-Wire Bonding

    In stock:

    100

    Place of origin:

    National

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    consumer hotline:00864001027270

    Brand:

    model:

    Own series:Packing Equipment-Wire Bonding

           作为业内顶尖的无铅回流焊炉制造商,埃莎公司拥有一些独特的回流焊工艺技术。

    多点喷嘴设计可以大大提高回流焊炉的热传导率和热补偿性,全程免震动设计可以避免无铅扰动焊点的产生,炉温曲线模拟生成软件更是可以大大提高工程师的工作效率。

    产品特点:

    1.德国品质,全热风技术,确保出色热补偿能力

    2.轨道全程免震动设计- 可用硬币站立试验予以验

    3.轨道稳定不变形,吸热量小,防止掉板

    4.轨道传送系统完全内循环  

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