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    铜线激光开封机:Radiance Laser Etch II System

    Applied to the semiconductor industry:

    Subsidiary Equipment-Others-数控设备

    In stock:

    100

    Place of origin:

    National

    Quantity:

    cut back increase

    price:

    Negotiable
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    Own series:Subsidiary Equipment-Others-数控设备

     产品特点:

    1.Radiance是专业从事激光源和激光刻蚀研发制造的领导者。

    2.使用激光烧蚀技术,可开异形形状无需治具

    3.能够去除所有类型的半导体封装。

          4.任何材料引线(金、铜、铝)的引线部分和第二焊点都可以开封。

           5.铜线产品的有效解决方案:激光开封后再进行化学开封对铜线损伤最小。

           6.利用开封程序实现简单的重复开封。

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