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    美国OE 3600 Plus粗铝丝焊线机(键合机)IGBT模块封装

    Applied to the semiconductor industry:

    Packing Equipment-Wire Bonding

    In stock:

    10

    Place of origin:

    National

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    Negotiable
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     美国OE 3600 Plus超声波粗铝丝焊线机(键合机)1台、年份2010年、9.5成新、设备状态正常;适用于混合功率器件、汽车电子模块、太阳能应用等。

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