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    接触式测厚仪

    Applied to the semiconductor industry:

    Testing Equipment-Thickness Measure-接触式测厚仪

    Specification model:

    CGG1

    Delivery period:

    1个月Day

    In stock:

    1

    Place of origin:

    United Kingdom

    Quantity:

    cut back increase

    price:

    100000.00
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    ¥10000.00

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    Brand:

    model:CGG1

    Own series:Testing Equipment-Thickness Measure-接触式测厚仪

    详细描述:用于测量晶圆各个点的厚度,根据各点的厚度结果可以用来判断晶圆产品的平整度,片内厚度差TTV是否符合要求

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