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    半导体MGP精密塑封模具

    Applied to the semiconductor industry:

    Packing Equipment-Injection&Molding-塑封模具

    Specification model:

    TO/SOT/SOP/DIP/TSSOP/MBF/MBS/ABS/

    In stock:

    10

    Place of origin:

    China-广东省

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    consumer hotline:00864001027270

    Brand:

    model:TO/SOT/SOP/DIP/TSSOP/MBF/MBS/ABS/

    Own series:Packing Equipment-Injection&Molding-塑封模具

     主要用于集成电路和半导体器件的后工序封装.特征:多料筒,多注射头封装方式,实现短距离填充.优点:塑封工艺好,封装质量提高,模盒采用快换结构,使用维护方便.适用封装品种:1) 80引线以下QFP,LQFP,TSOP,PLCC,SOT,SOD系列;2)矩阵式SOP,SSOP,TSSOP系列3)片钽,片感以及高要求的DIP,TO等4)42引线以上DIP,SDIP系列.

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