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    Magnetron Sputtering equipment

    Applied to the semiconductor industry:

    Second-hand equipment-Front

    Product brand

    AST

    In stock:

    100

    Place of origin:

    China-广东省

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    consumer hotline:00864001027270

    Brand:AST

    model:

    Own series:Second-hand equipment-Front

    AST Polychang Technology Psur-100VB Magnetic Enhanced Sputter is a mass production equipment designed for various metallization processes, diffusion barrier layer or reactive optical film applications.
    application
    AST Polychang Technology Psur-100VB Magnetic Enhanced Sputter is a mass production equipment designed for various metallization processes, diffusion barrier layer or reactive optical film applications. Especially in the production of III V semiconductors, the application of sputtering thin film deposition process has played an increasingly important role. The main applications can be divided into the following three categories:
    (1) WTi/Au/Ti or Ti/Au
    (2) TaN or TiWSiN
    (3) ITO or SiO 2, Ti 2
    Characteristic
    In order to meet the demand of mass production, Psur-100VB adopts Batch Type large-scale automatic mass production function design, which can greatly reduce the instability of yield and quality caused by human needs and human negligence, and ensure the overall effective output. In addition, modular design, excellent uniformity of coating and batch production mode can increase the production capacity by 250% and further reduce users. Capital expenditure and occupied area of equipment. The features of Psur-100VB sputtering equipment include:
    (1) high yield (80 * wafers for 2 ")
    (2) Reproducibility and stability of high coating quality
    (3) Excellent Batch to Batch coating uniformity (< 3%)
    (4) It can be matched with batch automatic software control function.
    (5) Up to 4 Cathodes of Target
    (6) Can be matched with DC-Pulse or RF sputtering mode
    (7) Suitable for different substrates. With the above functions, users can provide different operation modes for different production requirements.
    Specifications


    Wafer Numbers / Sizes
    (80 -10) pcs / (2"- 6")

    Sputter Cathodes
    Up to 4 sets (Option)

    Power Suppliers
    DC, Pulsed-DCRF (Option)

    Ultimate Pressure
    <  5E-7 Torr

    based Pressure
    5E-6 Torr within 30 mins

    Pumping System
    Turbomolecular Pump + Rotary Pump or
    Cryopump + Dry pump (Option)

    Automatic Control System
    Industrial HMI with Graphic User Interface

    Substrate Temperature Control
    RT ~ 350℃

    Non-Uniformity
    5% for WIW, WTWRTR

    Power Requirement
    AC220V, 3 phase, 60 Hz, 100A,

    Dry N2 Requirement
    1.2 kgw/cm2

    CDA Requirement
    5 kgw/cm2

    Water Requirement
    1.5 kgw/cm2, 20。, 40 l/min

    Dimension (WxDxH)
    1300 x 900 x 1800 (mm)

    Weight
    700 kgw

    advisory

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