AST Polychang Technology Psur-100VB Magnetic Enhanced Sputter is a mass production equipment designed for various metallization processes, diffusion barrier layer or reactive optical film applications.
application
AST Polychang Technology Psur-100VB Magnetic Enhanced Sputter is a mass production equipment designed for various metallization processes, diffusion barrier layer or reactive optical film applications. Especially in the production of III V semiconductors, the application of sputtering thin film deposition process has played an increasingly important role. The main applications can be divided into the following three categories:
(1) WTi/Au/Ti or Ti/Au
(2) TaN or TiWSiN
(3) ITO or SiO 2, Ti 2
Characteristic
In order to meet the demand of mass production, Psur-100VB adopts Batch Type large-scale automatic mass production function design, which can greatly reduce the instability of yield and quality caused by human needs and human negligence, and ensure the overall effective output. In addition, modular design, excellent uniformity of coating and batch production mode can increase the production capacity by 250% and further reduce users. Capital expenditure and occupied area of equipment. The features of Psur-100VB sputtering equipment include:
(1) high yield (80 * wafers for 2 ")
(2) Reproducibility and stability of high coating quality
(3) Excellent Batch to Batch coating uniformity (< 3%)
(4) It can be matched with batch automatic software control function.
(5) Up to 4 Cathodes of Target
(6) Can be matched with DC-Pulse or RF sputtering mode
(7) Suitable for different substrates. With the above functions, users can provide different operation modes for different production requirements.
Specifications
Wafer Numbers / Sizes
(80 -10) pcs / (2"- 6")
Sputter Cathodes
Up to 4 sets (Option)
Power Suppliers
DC, Pulsed-DCRF (Option)
Ultimate Pressure
< 5E-7 Torr
based Pressure
5E-6 Torr within 30 mins
Pumping System
Turbomolecular Pump + Rotary Pump or
Cryopump + Dry pump (Option)
Automatic Control System
Industrial HMI with Graphic User Interface
Substrate Temperature Control
RT ~ 350℃
Non-Uniformity
5% for WIW, WTWRTR
Power Requirement
AC220V, 3 phase, 60 Hz, 100A,
Dry N2 Requirement
1.2 kgw/cm2
CDA Requirement
5 kgw/cm2
Water Requirement
1.5 kgw/cm2, 20。, 40 l/min
Dimension (WxDxH)
1300 x 900 x 1800 (mm)
Weight
700 kgw