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Current Position: Home » Equipment » Second-hand equipment » Front »AST Tbon-100 晶圆热压黏合机台
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    AST Tbon-100 晶圆热压黏合机台

    Applied to the semiconductor industry：

    Second-hand equipment-Front

    In stock：

    100

    Place of origin：

    National

    Quantity：

    cut back increase

    price：

    Negotiable
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    model：

    Own series：Second-hand equipment-Front

     AST聚昌科技最新的晶圆热压黏合机台Tbon-100，除了整合先进的施压力控制、真空环境及分离式加热器设计，符合多阶段独立控制之真空热压黏合能力，应用在ⅢⅤ族Power chip LED、MEMS 、SOI等製程，其Uniformity及Yield Rate均大幅超越业界现有之机台。


    特点

    Tbon-100 Wafer Bonder的特点包括：
    (1) 高产出率
    (2) 高製程品质再现性与稳定性
    (3) 全自动操控介面
    (4) 模组化设计，最小的使用面积。

    规格

    Wafer Numbers / Sizes 1 pairs / (2"- 6") 
    Press Force 3.5 ~ 10 KN (Option) 
    Upper/Lower Temperature Control 350 ~ 700 oC (Option) 
    base Pressure < 1 Torr 
    Pumping System Oil-Free Dry pump 
    Automatic Control System Industrial HMI with Graphic User Interface 
    Power Requirement AC220V, 3 phase, 60 Hz, 30A, 
    Dry N2 Requirement 1.2 kgw/cm2 
    CDA Requirement 5 kgw/cm2 
    Water Requirement 1.5 kgw/cm2, 20℃, 10 l/min 
    Dimension (WxDxH) 850 x 800 x 1650 (mm) 
    Weight 120 kgw

    advisory

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