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AML晶圆接合器
晶片接合在MST，MEMS和微工程领域中已经发现了许多应用。 这些包括压力传感器，加速度计，微型泵和其他流体处理装置的制造。 该工艺还用于硅微结构的一级封装以隔离封装引起的应力。
OAI AML晶片接合器促进在高真空室中原位进行对准和接合。 对于阳极接合，将晶片冷加载并在处理室中加热。 对于高精度对准，晶片被对准并且仅在达到工艺温度之后才接触，因此避免了可能损害对准的不同的热膨胀效应。 AML晶片接合器非常适合阳极接合，硅直接和热压接合应用。 这些特性使焊接机能够与几乎任何加工工具一起使用。
Wafer bonding has found many applications in the field of MST, MEMS and micro engineering. These include the fabrication of pressure sensors, accelerometers, micro-pumps and other fluid handling devices. The process is also used for first-order packaging of silicon microstructures to isolate package-induced stresses.
The OAI AML Wafer Bonder facilitates both the alignment and bonding to be performed in-situ, in a high vacuum chamber. For anodic bonding the wafers are loaded cold and heated in the process chamber. For high accuracy alignment the wafers are aligned and brought into contact only after the process temperature has been reached, thus avoiding differential thermal expansion effects which can compromise alignment. The AML Wafer Bonder is excellent for anodic bonding, silicon direct and thermal compression bonding applications. These features enable the bonder to be used with virtually any processing tool.
