Product characteristics:
Patented optical head, with wavelength IR1310 probe, can accurately measure the position and thickness of the object to be measured in a non-co
ntact manner.
Combined with coaxial IR and white light microscopy, with the probe of wavelength IR1310, the observation point is the measurement point, and the execution of programming is faster.
Depending on the customer's needs, it can also provide a fully automated platform with a maximum measurable size of 2 inches wafer.
It can be matched with perspective and reflection IR light source to increase infrared observation function.
Sensor can be installed to measure 3D profile of film and product surface.
Application:
- TSV Depth and Width
Thinning process
Stacking process
3D IC counterpoint
Thickness Measurement of Multi-Layer Stacked Sandwiches
Bump height
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3D IC TSV