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    薄膜应力&晶圆弯曲(翘曲)测试系统 美国芦华

    Applied to the semiconductor industry:

    Testing Equipment-Mechanical Test-应力检测仪

    Product brand

    美国芦华

    In stock:

    100

    Place of origin:

    United States

    Quantity:

    cut back increase

    price:

    10000.00
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    ¥10000.00

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    Brand:美国芦华

    model:

    Own series:Testing Equipment-Mechanical Test-应力检测仪

    薄膜应力&晶圆弯曲(翘曲)测试系统 美国芦华
    Film Stress & Wafer Bow Measurement System

    美国FSM(Frontier Semiconductor)

    薄膜淀积后,随着温度降低,由于衬底与薄膜热膨胀系数差异,从而导致应力和弯曲(翘曲)。FSM集成世界领先的无损激光扫描技术,每毫米扫描40个数据点,可快速生产2D、3D彩图。
    室温系统 FSM 128 最大样品直径200mm
    FSM 128L 最大样品直径300mm
    FSM 128G 最大样品550×650mm
    变温系 FSM 500TC 电阻加热工作台:温度可控,最高500℃
    FSM 900TC-vac RTP型腔室:温度可控,最高900℃(可选1100℃);真空达到 1E-6 Torr

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    请问曲率半径测试范围、测试平台行程XY、、曲率半径误差多大?

    2017klkl  2017-08-02

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