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    新半导体LED焊线机——福PHOTON

    Applied to the semiconductor industry:

    Packing Equipment-Wire Bonding-铝、铜焊线机

    Product brand

    翠涛

    In stock:

    100

    Place of origin:

    National

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    consumer hotline:00864001027270

    Brand:翠涛

    model:

    Own series:Packing Equipment-Wire Bonding-铝、铜焊线机

    新半导体LED焊线机——福PHOTON
    适用于:SMD、COB、集成、大功率等

    优势:

    1.高速度:UPH比原800B系列提升20%;

    2.宽行程:有效焊接Y宽度72mm;

    3.高精度:最小焊盘尺寸45μm。

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