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    半自动剥膜机

    Applied to the semiconductor industry:

    Processing Equipment-Wafer Bonder-其他

    In stock:

    100

    Place of origin:

    China-上海市

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    consumer hotline:00864001027270

    Brand:

    model:

    Own series:Processing Equipment-Wafer Bonder-其他

     DM系列是专门用于晶圆、PCB、QFN等设计的剥膜机,该机能方便高效地将切割后的器件从粘性膜上分离下来,不会损伤器件本身。

     

    产品特点:  

    Ø 适用于蓝膜、UV膜、PET衬底膜及其它单/双层膜;

    Ø 配备调速伺服电机,控制晶粒间距;

    Ø 适用精密线性导轨,稳定性跟老式链条机型比,提升10倍;

    Ø 剥膜刀口间距可调整,适应不同厚度的膜;

    Ø QFN机型,剥离后,产品直接承接在方盒内;

    Ø 可选装去静电离子棒。

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