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    划片刀

    Applied to the semiconductor industry:

    Proc-Equip Consumable-Dicing-刀片

    Product Brand

    ZZJYKJ

    In stock:

    10000

    Place of origin:

    China-河南省

    Quantity:

    cut back increase

    Price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    Brand:ZZJYKJ

    Model:

    Own series:Proc-Equip Consumable-Dicing-刀片

     产品特点:切缝窄:可控制在15um宽度;提速快:不需要磨刀板进行磨刀,可直接安装后进行预切割提速;具有强韧性、高精度,能够保持稳定、良好的切削力、寿命长等优点
    1 q& B% [% _value="6" unitname="a" w:st="on">6 A' K. L
    应用范围:半导体分立器件(肖特基、GPP单双向、MOS)ICLedGaAsAlGaInP)、其它材料等

    5 x8 Q4 I5 p5 `
    我司生产的划片刀已经在切割品质与寿命方面完全可以替代日本进口刀,欢迎广大客户来电咨询选购!

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    Question:
     
    Ask

    你们做树脂软刀?公差多大??

    ghby  2017-08-16

     树脂刀不做!

    2017-08-28

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