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    切割刀片

    Applied to the semiconductor industry:

    Proc-Equip Consumable-Dicing-刀片

    In stock:

    100

    Place of origin:

    National

    Quantity:

    cut back increase

    Price:

    200.00
    Transaction guarantee Secured Transactions Online banking to pay

    Consumer Hotline:00864001027270

    Brand:

    Model:

    Own series:Proc-Equip Consumable-Dicing-刀片

      产品特点:

    ●因具有高耐磨性與高剛性,最適用於難加工材料的精密加工 

    ●切割刀片剛性高,可以抑制傾斜切割及蛇形切割等不良加工現象的發生 

    ●結合劑品種豐富,可適用於玻璃,晶粒級封裝(CSP)等各種不同材料的切割加工 

    ●通過精確的集中度調整,可以有效控制加工質量及使用壽命

      加工对象:

    电子元件;各种半导体封装元件;光学零部件;陶瓷;玻璃;其他多种材料

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