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    DISCO切割刀片

    Applied to the semiconductor industry:

    Proc-Equip Consumable-Dicing-刀片

    In stock:

    10

    Place of origin:

    National

    Quantity:

    cut back increase

    Price:

    Negotiable
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    Consumer Hotline:00864001027270

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    Own series:Proc-Equip Consumable-Dicing-刀片

     

    NBC-ZH系列拥有优越的研削性能及较长的使用寿命,可有效提高生产效率及加工品质。

    迪思科公司以其独特的技术开发出了轮壳型切割刀片【NBC-ZH】系列。通过采用高性能超薄金刚石(砧石)刀与铝合金法兰盘的一体化结构,不但提高了加工效率而且获得了稳定的加工品质。并借助迪思科公司丰富的应用加工技术,在切割加工硅(矽)晶圆及以GaAs为代表的化合物半导体晶圆时,能够获得优越的加工品质。

    ●可进行高难度的倒角切割和阶梯切割加工

    ●多尺寸磨料与各种结合剂的有机结合,可满足用另不同的加工要求

    ●使超薄型切割刀片的装卸作业更方便

    ●由于提高了操作便利性,可大幅度缩短切割刀片交换及设备维护所需要的时间

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