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    LED封装材料 高折光率OE-6662

    Applied to the semiconductor industry:

    Pack-Equip Consumable-Others

    In stock:

    1000

    Place of origin:

    China-天津市

    Quantity:

    cut back increase

    Price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    Brand:

    Model:

    Own series:Pack-Equip Consumable-Others

     

    基础参数:

     

     

     

     

    1.875kg/组,混合比例14混合后粘度4000m*PaS硬度D65,折射率1.53

     

     

     

     

    特征及应用:

     

     

     

     

     

    高硬度高折射;适用于SMD封装

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