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    优势价格供应狮力昴UV膜

    Applied to the semiconductor industry:

    Proc-Equip Consumable-Lapping&Polishing-设备其他配件

    Product Brand

    SLIONTEC

    Specification model:

    见规格表

    Delivery period:

    30天Day

    In stock:

    10000

    Place of origin:

    China-上海市

    Quantity:

    cut back increase

    Price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    Consumer Hotline:00864001027270

    Brand:SLIONTEC

    Model:见规格表

    Own series:Proc-Equip Consumable-Lapping&Polishing-设备其他配件

     产品简介 

    UV型的切割胶带,是在各种硅片、封装基板、陶瓷、玻璃、水晶等 

    多种工件的切割工程中使用的胶带。通常使用紫外线来降低粘着力,使之 

    更易剥离。 

    特点 

    1, 品种齐全,胶层有多种厚度(5~25um) 

    2, 减少背崩以及防止飞料,以及芯片飞溅 

    3, 实现Easy Pick-up(容易剥离) 

    4, 对EMC(Epoxy Molding Compound半导体环氧合成高分子封装材料)等较难接着的工件,也具有优质的贴附性 

    5, 防静电型(选项)

    一般物理特性

    A. Slion Dicing Tape series (for Wafer)

    Item No.

    All Expandable type

    6360

     -00

    6360

     -20

    6360

     -50

    6360

     -80

    6330

     -00

    UV / non-UV

    UV

    Non-UV

    Thickness

    (µm)

    Liner : 38 µm

    Backing

    PO

    90

    PO

    90

    PO

    90

    PO

    100

    PO90

    Adhesive

    10

    10

    10

    10

    10

    Total

    100

    100

    100

    110

    100

    Peeling Strength:

    (N/10mm)

     

     (After UV)

    SUS

    2.60

    0.16

    3.20

    0.22

    2.50

    0.08

    0.59

    0.03

    0.39

    Glass

    2.70

    0.18

    3.30

    0.24

    2.60

    0.10

    0.60

    0.03

    0.32

    Si Wafer

    (Mirror)

    2.50

    0.15

    3.30

    0.24

    2.50

    0.09

    0.62

    0.02

    0.32

    Holding Power

    0.1mm

    0.1mm

    0.1mm

    0.1mm

    0.1mm

    Tensile Strength (TD/MD 

    – Before UV N/10㎜)

    17/20

    17/20

    17/20

    20/20

    16/18

    Elongation TD/MD

     – Before UV (%/10㎜)

    760/770

    760/770

    760/770

    550/510

    700/600

    Remark (type)

     

    Standard

    High

    Adhesion

    For chip

    flying

    Easy

    pick-up

     

    Excellent

    Chipping

    resistance

     

    Standard

     

     

    B. Slion Dicing Tape series (for Substrate)

    Item No.

    All UV Type

    6360

    -15

    6360

    -25

    6360

     -55

    6360

     -95

    6240

     -20

    UV Expandable type

    UV

     Non-expand

    Thickness

    (µm)

    Liner : 38 µm

    Backing

    PO

    150

    PO

    150

    PO

    150

    PO

    150

    PET

    100

    Adhesive

    10

    10

    10

    20

    30

    Total

    160

    160

    160

    170

    130

    Peeling

    Strength:

    (N/10mm)

    (After UV)

    SUS

    3.00

    0.22

    3.50

    0.24

    2.90

    0.09

    4.10

    0.10

    4.00

    0.20

    Glass

    3.20

    0.24

    3.70

    0.26

    3.10

    0.12

    4.30

    0.20

    4.60

    0.30

    Si Wafer

     (Mirror)

    3.00

    0.22

    3.60

    0.25

    2.90

    0.12

    4.10

    0.12

    4.40

    0.28

    Epoxy resin

    2.80

    0.30

    3.20

    0.30

    2.70

    0.14

    4.30

    0.20

    4.10

    0.30

    Holding Power

    0.1mm

    0.1mm

     0.1mm

     0.1mm

    0.1mm

    Tensile Strength (TD/MD

    – Before UV N/10㎜)

    30/30

    30/30

    30/30

    30/32

    Elongation TD/MD

    –Before UV (%/10㎜)

    900/840

    900/840

    900/840

    900/850

    Remark (type)

    Standard

    High

    Adhesion

    Easy

    pick-up

    For high

     bumpy

    surface

    Ceramic

    Glass

     substrate

    Advisory

    If you have any questions before purchasing, please contact us.

    Question:
     

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