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    手动共晶粘片机

    Applied to the semiconductor industry:

    Processing Equipment-Wafer Bonder-手动粘片机

    Product brand

    美国HYBOND

    Specification model:

    626

    Delivery period:

    6个月Day

    In stock:

    100

    Place of origin:

    China

    Quantity:

    cut back increase

    price:

    1.00
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    ¥10000.00

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    Brand:美国HYBOND

    model:626

    Own series:Processing Equipment-Wafer Bonder-手动粘片机

     626是一款能够进行球焊、楔焊、制作凸点、钉桩的长臂深腔引线键合机。626可以应用线径18~51um的金丝进行球焊,也可以应用12~76um金属丝或者截面达到25×510um的金属带进行楔焊或钉桩焊接。626特别适用于一焊和二焊之间有极大的高度差别的地方, 对于焊接敏感器件,像FET和LED领域所用的砷化镓, 626也具有优良的性能。626的电动供料和丝/带夹具对丝/带提供极为出色的控制,并且允许操作者通过一个触摸开关以25um的步进量增加或减少尾线长度。626可为焊接设定参数并通过显示屏显示出来。626从球焊切换成楔焊只需按一个按钮把打火杆电压调整为0,并把邦定头换成劈刀即可。626也可进行制作凸点和钉桩焊操作。

     

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