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    手动粘片机

    Applied to the semiconductor industry:

    Processing Equipment-Wafer Bonder-手动粘片机

    Specification model:

    8头

    Delivery period:

    交货期一个月Day

    In stock:

    2

    Place of origin:

    United Kingdom

    Quantity:

    cut back increase

    price:

    42000.00
    Transaction guarantee Secured Transactions Online banking to pay

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    ¥10000.00

    Concerned Products

    Brand:

    model:8头

    Own series:Processing Equipment-Wafer Bonder-手动粘片机


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