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    日东电工MA2008IIR/ MA2008IIP全自动划片贴膜机

    Applied to the semiconductor industry:

    Processing Equipment-Others

    Product brand

    日东电工

    Specification model:

    MA2008IIR/ MA2008IIP

    In stock:

    10

    Place of origin:

    Japan

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    Brand:日东电工

    model:MA2008IIR/ MA2008IIP

    Own series:Processing Equipment-Others

       MA2008IIR/MA2008IIP
     
      可用于各种综合应用:
     
      DSC、晶圆堆叠架;非接触壁、非接触工作台;
     
      保护胶带剥离/紫外线辐照;面板装配
     
      MA2008IIR:用于卷胶带
     
      MA2008IIP:用于预切胶带
     
      可通过触摸面板和食谱功能实现简易操作
     
      日志文件功能标准设备;可添设晶圆映射扫描仪
     
      符合SECS/GEM标准;CE mark/SEMI S2/S8"规范要求
     
      可用框架尺寸:8英寸(in)/6英寸(in)
     
      可用晶圆尺寸:8/6/5/4英寸(in)
     
      可用晶圆厚度:200 um 或更厚(接触工作台)、250 um 或更厚(非接触工作台)
     
      吞吐量:MA2008IIR:75晶圆/小时
     
      MA2008IIP:70晶圆/小时 

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