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    NITTO DENKO 日东电工HSA840II 8寸半自动撕膜机 揭膜机

    Applied to the semiconductor industry:

    Processing Equipment-Others

    Product brand

    日东电工

    Specification model:

    8寸MSA840II

    In stock:

    100

    Place of origin:

    National

    Quantity:

    cut back increase

    price:

    Negotiable
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    Concerned Products

    Brand:日东电工

    model:8寸MSA840II

    Own series:Processing Equipment-Others

       HSA840II
     
      可处理 8""/6""/5""/4""的晶圆
     
      可在 1个工作台处理 8"-4"的晶圆
     
      触摸面板,便于操作
     
      符合 CE mark/SEMI S2/S8"规范要求
     
      可用晶圆厚度:250 um 或更厚
     
      吞吐量:应用 50秒/晶圆 

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