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    日东电工HR8500III全自动划片撕膜设备

    Applied to the semiconductor industry:

    Processing Equipment-Others

    Product brand

    日东电工

    Specification model:

    4,5,6,8寸

    In stock:

    100

    Place of origin:

    National

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    Brand:日东电工

    model:4,5,6,8寸

    Own series:Processing Equipment-Others

     HR8500III
    可处理 8""/6""/5"" 的晶圆 
    具有处理 4"" 晶圆的功能(可选)
    工作台加热功能
    可用于较薄的晶圆(TW 系列)
    触摸面板,便于操作
    符合 CE mark 规范要求。
    符合 SECS/GEM 标准
    可用晶圆厚度:250 um 或更厚 TW 系列:150 um 或更厚
    吞吐量:85 晶圆/小时(TW 系列:68 晶圆/小时)

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