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    日东电工 HR3000III全自动研磨撕膜机揭膜机

    Applied to the semiconductor industry:

    Processing Equipment-Others

    Product brand

    日东电工

    Specification model:

    300 mm/200 mm

    In stock:

    100

    Place of origin:

    Japan

    Quantity:

    cut back increase

    price:

    Negotiable
    Transaction guarantee Secured Transactions Online banking to pay

    Brand:日东电工

    model:300 mm/200 mm

    Own series:Processing Equipment-Others

       HR3000III
     
      具有前开式晶圆盒
     
      开放式晶圆匣
     
      具有剥离触发器,因此具有稳定的剥离效果
     
      通过对剥离棒的准确控制可实现较低应力的剥离
     
      可通过触摸面板和配方功能实现简易操作
     
      日志文件功能标准设备
     
      符合 CE 标志/SEMI S2/S8规范要求
     
      可添设晶圆映射扫描仪
     
      符合 SECS/GEM 标准
     
      可用晶圆尺寸:300 mm/200 mm
     
      可用晶圆厚度:100 um 或更厚
     
      吞吐量:60晶圆/小时 

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